Title:
HEAT-RADIATING SEMICONDUCTOR PACKAGE HAVING HEAT-CONDUCTING MEMBER EMBEDDED THEREIN, METHOD FOR MANUFACTURING SAME, AND INDUCTION HEATING SOLDERING DEVICE USED TO MANUFACTURE SAME
Document Type and Number:
WIPO Patent Application WO/2023/249316
Kind Code:
A1
Abstract:
The present invention relates to a heat-radiating semiconductor package having a heat-conducting member embedded therein, and method for manufacturing same, wherein a heat-conducting member is embedded in a molding portion which constitutes the exterior of the semiconductor package, as a heat-radiating means for radiating heat generated inside the semiconductor package to the outside, thereby implementing optical heat conductance within the smallest thickness of the molding portion of the semiconductor package.
Inventors:
KIM JUN SIK (KR)
KIM YOUNG DO (KR)
CHOI JUNG SIK (KR)
JUNG TAE KYOUNG (KR)
PARK IN HO (KR)
KIM YOUNG DO (KR)
CHOI JUNG SIK (KR)
JUNG TAE KYOUNG (KR)
PARK IN HO (KR)
Application Number:
PCT/KR2023/008232
Publication Date:
December 28, 2023
Filing Date:
June 15, 2023
Export Citation:
Assignee:
BS TECHNICS CO LTD (KR)
International Classes:
H01L23/373; H01L21/48; H01L21/67; H01L23/12; H01L23/31; H01L23/367; H05B6/04; H05B6/10
Foreign References:
| KR20170020663A | 2017-02-23 | |||
| KR20150053496A | 2015-05-18 | |||
| KR20150137976A | 2015-12-09 | |||
| KR20130123956A | 2013-11-13 | |||
| KR20120110711A | 2012-10-10 |
Attorney, Agent or Firm:
KIM, Jeong Hyeon (KR)
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