Title:
HEAT RADIATION COMPOSITE FILM
Document Type and Number:
WIPO Patent Application WO/2024/084837
Kind Code:
A1
Abstract:
The present invention is a heat radiation composite film that includes a heat radiating layer and an adhesive layer, the film being characterized in that: the thickness of the heat radiating layer is 5-200 μｍ; one surface of the heat radiating layer is a rough surface with an emissivity of 0.80 or more and a developed area ratio of 1.5 or more; and the adhesive layer is provided on the surface opposite the rough surface of the heat radiating layer. Due to this configuration, it is possible to provide a heat radiation composite film with which the temperature of a heat source can be reduced effectively.
Inventors:
IMAIZUMI KEIJI (JP)
ENDO AKIHIRO (JP)
ENDO AKIHIRO (JP)
Application Number:
PCT/JP2023/031732
Publication Date:
April 25, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
SHIN ETSU CHEMICAL CO LTD (JP)
International Classes:
H01L23/36; B32B7/027; B32B27/00; C09J7/38; C09J11/04; C09J183/05; C09J183/07; H01L23/373; H05K7/20
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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