Title:
HEAT RELEASABLE ADHESIVE, ARTICLE AND RELEASE METHOD
Document Type and Number:
WIPO Patent Application WO/2022/230928
Kind Code:
A1
Abstract:
A heat releasable adhesive which contains a (meth)acrylic polymer having, in a side chain and/or at an end, a kinetic covalent bond that is capable of reversibly making a dissociation and a bond by means of heating and cooling. An article which comprises an adherend and the above-described heat releasable adhesive adhered to this adherend. A release method which comprises a heating step in which the above-described article is heated.
Inventors:
OTSUKA HIDEYUKI (JP)
AOKI DAISUKE (JP)
KATAOKA SHIMON (JP)
AOKI DAISUKE (JP)
KATAOKA SHIMON (JP)
Application Number:
PCT/JP2022/019050
Publication Date:
November 03, 2022
Filing Date:
April 27, 2022
Export Citation:
Assignee:
UNIV KYUSHU NAT UNIV CORP (JP)
International Classes:
C09J133/04; C08F8/34; C08F120/38; C09J5/00
Foreign References:
CN111363153A | 2020-07-03 | |||
JPS57115470A | 1982-07-17 | |||
JP2010215624A | 2010-09-30 | |||
JP2013004868A | 2013-01-07 | |||
CN114149543A | 2022-03-08 |
Other References:
KATAOKA SHIMON, TSURUOKA AYUKO, AOKI DAISUKE, OTSUKA HIDEYUKI: "Fast and Reversible Cross-Linking Reactions of Thermoresponsive Polymers Based on Dynamic Dialkylaminodisulfide Exchange", ACS APPLIED POLYMER MATERIALS, vol. 3, no. 2, 12 February 2021 (2021-02-12), pages 888 - 895, XP055982463, ISSN: 2637-6105, DOI: 10.1021/acsapm.0c01205
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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