Title:
HEAT RESISTANCE STABILIZING AID AND HEAT RESISTANCE STABILIZER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/002192
Kind Code:
A1
Abstract:
Provided are a heat resistance stabilizing aid that, by combined use with a heat resistance stabilizer, suppresses the occurrence of discoloration, cracking, etc., further improves the mechanical properties, and gives excellent heat resistance and mechanical properties in an organic material, especially a synthetic resin, and a heat resistance stabilizer composition. Also provided is a heat-resistant synthetic resin composition having suppressed occurrence of discoloration, cracking, etc., improved mechanical properties, and excellent heat resistance and mechanical properties. Additionally provided is a molded article having an excellent appearance due to the absence of discoloration, cracking, etc. as well as having excellent mechanical properties. A heat resistance stabilizing aid containing one or more phosphate amine salts comprising 1,4-diazacyclohexane and phosphoric acid and a heat resistance stabilizer composition obtained by blending this heat resistance stabilizing aid with a heat resistance stabilizer.
Inventors:
BANNO KEISUKE (JP)
MITSUHASHI AYAKA (JP)
SHIMIZU TATSUYA (JP)
SAKURAI HISASHI (JP)
YONEZAWA YUTAKA (JP)
TANJI NAOKO (JP)
MITSUHASHI AYAKA (JP)
SHIMIZU TATSUYA (JP)
SAKURAI HISASHI (JP)
YONEZAWA YUTAKA (JP)
TANJI NAOKO (JP)
Application Number:
PCT/JP2020/023625
Publication Date:
January 07, 2021
Filing Date:
June 16, 2020
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C09K15/32; C08L101/00
Domestic Patent References:
WO2017179289A1 | 2017-10-19 | |||
WO2018181676A1 | 2018-10-04 |
Foreign References:
JP2014012704A | 2014-01-23 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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