Title:
HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR INSPECTION
Document Type and Number:
WIPO Patent Application WO/2014/199993
Kind Code:
A1
Abstract:
Provided is a heat-resistant adhesive sheet for semiconductor inspection that makes deformation of the adhesive sheet due to heating less likely to occur. This heat-resistant adhesive sheet for semiconductor inspection is used in a step for inspecting performance while heating a semiconductor chip, wherein the adhesive sheet is provided with an adhesive layer on a base material, the base material having a thermal shrinkage coefficient of less than 1% when heated for 30 minutes at 150°C and a linear expansion coefficient at 60-150°C of 5.0 × 10-5/K or less, the adhesive layer of the adhesive sheet containing a compound photopolymerizable with a (meth)acrylic acid ester copolymer, a polyfunctional isocyanate curing agent, and a photopolymerization initiator, there being 5-200 parts by mass of the photopolymerizable compound, 0.5-20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1-20 parts by mass of the photopolymerization initiator per 100 parts by weight of (meth)acrylic acid ester copolymer, and the adhesive layer containing no tackifier resin. The adhesive layer of the adhesive sheet preferably contains a silicone graft copolymer.
Inventors:
NAKAJIMA GOSUKE (JP)
TSUKUI TOMOYA (JP)
TSUKUI TOMOYA (JP)
Application Number:
PCT/JP2014/065370
Publication Date:
December 18, 2014
Filing Date:
June 10, 2014
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
C09J7/35; C09J11/06; C09J133/06; C09J175/04; C09J183/10; H01L21/02
Domestic Patent References:
| WO2012165368A1 | 2012-12-06 |
Foreign References:
| JP2004031463A | 2004-01-29 | |||
| JP2005298579A | 2005-10-27 |
Attorney, Agent or Firm:
EBISU International Patent Office (JP)
Patent business corporation エビス international patent firm (JP)
Patent business corporation エビス international patent firm (JP)
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