HEAT-RESISTANT RESIN, METHOD FOR PRODUCTION THEREOF AND BASE PLATE FOR DUST REMOVAL OF SUBSTRATE TREATING DEVICE USING THE RESIN

WIPO Patent Application WO/2005/123809

A1

A heat-resistant resin which is obtained by reacting a tetra-carboxylic acid anhydride, an aliphatic diamine and an elastomer having two or more carboxyl groups; a method for producing the heat-resistant resin; and a base plate for the dust removal of a substrate treating device which uses said heat-resistant resin. The heat-resistant resin can be used, in particular, as a tool for dust removal, even in a situation wherein the contamination of a silicone may cause a serious trouble, such as in HDD use or in a part of semiconductor use.

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FUJII HIROFUMI (JP)
UENDA DAISUKE (JP)
MARUOKA NOBUAKI (JP)
TERADA YOSHIO (JP)
ISHIZAKA HITOSHI (JP)
NAMIKAWA MAKOTO (JP)

PCT/JP2005/011457

December 29, 2005

June 22, 2005

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NITTO DENKO CORP (JP)
FUJII HIROFUMI (JP)
UENDA DAISUKE (JP)
MARUOKA NOBUAKI (JP)
TERADA YOSHIO (JP)
ISHIZAKA HITOSHI (JP)
NAMIKAWA MAKOTO (JP)

C08G73/10; (IPC1-7): C08G73/10

JPH0812763A	1996-01-16
JPH1121455A	1999-01-26
JP2000086888A	2000-03-28
JP2005042086A	2005-02-17

Oguri, Shohei (7-13 Nishi-Shimbashi 1-chom, Minato-ku Tokyo 03, JP)

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