HEAT-SENSITIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION

WIPO Patent Application WO/2003/060032

A1

The invention relates to a heat-sensitive pressure -sensitive adhesive composition which exerts tackiness on heat -melting to adhere or bond to various substrates, in spite of its being non-tacky at ordinary temperatures; and a heat-sensitive pressure-sensitive adhesive sheet produced by applying the composition on a substrate. The heat-sensitive pressure-sensitive adhesive compositions of the prior art had problems of deformation, cracking, and chipping of an adherend, and low production efficiency due to long solidification time of the pressure-sensitive adhesive layer. According to the invention, the addition of a sulfur-containing antioxidant, a surfactant, and so on to compounds represented by the general formula (I) brings about heat-sensitive pressure-sensitive adhesives having high tackiness and being capable of giving products of solidification which are excellent in rigidity and permit washing with warm water. Additionally, the addition of a nucleating agent brings about a reduction in the solidification time.

SUGA MAMORU (JP)
KOBAYASHI KOUJI (JP)
TOKUSHIGE TADAFUMI (JP)

PCT/JP2003/000069

July 24, 2003

January 08, 2003

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API CORP (JP)
SUGA MAMORU (JP)
KOBAYASHI KOUJI (JP)
TOKUSHIGE TADAFUMI (JP)

C09J7/22; C09J7/35; C09J11/06; (IPC1-7): C09J11/06; C09J7/02

JPS5743427A	1982-03-11
JP2001098162A	2001-04-10
JP2001152128A	2001-06-05
JPH07247468A	1995-09-26
EP0942037A1	1999-09-15

Tani, Yoshitaka (3F 1-13 Awajimachi 2-chom, Chuo-ku Osaka-shi Osaka, JP)

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