Title:
HEAT-SENSITIVE RECORDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/100902
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a heat-sensitive recording material having improved thermal responsiveness and improved storage stability of a printed area and background, compared to conventional heat-sensitive recording materials containing a non-phenolic compound as a developer. The present invention pertains to a heat-sensitive recording composition containing a color former, a developer, a sensitizer, and a stabilizer, wherein the developer is [3-(3-phenylureido)phenyl]=4-methylbenzenesulfonate, N-[2-(3-phenylureido)phenyl]benzenesulfonamide, or N-(p-toluenesulfonyl)-N'-(3-p-toluenesulfonyloxyphenyl)urea, the sensitizer is diphenylsulfone or 1,2-bis(3-methylphenoxy)ethane, and the stabilizer is 1,3-diphenylurea.
Inventors:
TODA YOUSUKE (JP)
SHIBAGAKI KOUSUKE (JP)
MIYANAGA KYOHEI (JP)
SHIBAGAKI KOUSUKE (JP)
MIYANAGA KYOHEI (JP)
Application Number:
PCT/JP2022/044059
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
B41M5/333; B41M5/327; B41M5/337; B41M5/42
Domestic Patent References:
| WO2021095751A1 | 2021-05-20 |
Foreign References:
| JP2019126933A | 2019-08-01 | |||
| JP2018012270A | 2018-01-25 | |||
| JP2018012269A | 2018-01-25 | |||
| JP2020040287A | 2020-03-19 | |||
| JP2019130879A | 2019-08-08 | |||
| JP2014226848A | 2014-12-08 | |||
| JP2002532441A | 2002-10-02 |
Attorney, Agent or Firm:
ASAMURA IP P.C. (JP)
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