Title:
HEAT SHIELD DEVICE, HEAT SHIELD FILM, AND HEAT SHIELDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/071511
Kind Code:
A1
Abstract:
The present disclosure provides a heat shield device 101 provided with a heat shield film 10 including: particles absorbing infrared rays to generate electrons and holes; and an acceptor receiving the electrons or the holes from the particles, wherein charge carriers selected from the electrons and the holes are discharged from the heat shield film 10 to the outside of the device. The heat shield device 101 can function as a "heat removal" device. The heat shield film 10 may be a single layer or may be a multilayer film.
Inventors:
SAKAMOTO MASANORI (JP)
Application Number:
PCT/JP2021/036231
Publication Date:
April 07, 2022
Filing Date:
September 30, 2021
Export Citation:
Assignee:
UNIV KYOTO (JP)
International Classes:
G02B5/22; C03C27/06; E04B1/76; H05K7/20
Domestic Patent References:
| WO2016185951A1 | 2016-11-24 |
Foreign References:
| JP2011012112A | 2011-01-20 | |||
| JPH07315889A | 1995-12-05 | |||
| JP2006010759A | 2006-01-12 | |||
| JP2011181636A | 2011-09-15 | |||
| JP2001313513A | 2001-11-09 | |||
| JP2000151247A | 2000-05-30 |
Other References:
J. AM. CHEM. SOC., vol. 132, 2010, pages 9250 - 9252
NANO LETTERS, vol. 19, no. 11, 2019, pages 8149 - 8154
MATERIALS CHEMISTRY AND PHYSICS, vol. 166, 15 September 2015 (2015-09-15), pages 87 - 94
NANO LETTERS, vol. 19, no. 11, 2019, pages 8149 - 8154
MATERIALS CHEMISTRY AND PHYSICS, vol. 166, 15 September 2015 (2015-09-15), pages 87 - 94
Attorney, Agent or Firm:
KAMADA Koichi (JP)
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