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Patent Searching and Data


Title:
HEAT-SHRINKABLE FILM AND HEAT-SHRINKABLE LABEL
Document Type and Number:
WIPO Patent Application WO/2013/011826
Kind Code:
A1
Abstract:
Provided are a heat-shrinkable film having superior abrasion resistance and a heat-shrinkable label using the film. The heat-shrinkable film is characterized in being obtained by coating a film substrate formed from a polyester resin or polystyrene resin using an aqueous coating material formed from an emulsion (A), which comprises a polymer of an ethylenic unsaturated monomer the protective colloid of which is a water-soluble polyester or water-dispersible polyester, and a wax lubricant (B). Preferably the wax lubricant (B) is a polyethylene wax or polyproylene wax and has a melting point between 90 and 160ºC.

Inventors:
YASUI YOSHIKATSU (JP)
DOI MITSURU (JP)
NOZAKI TAKANORI (JP)
MARUICHI NAOYUKI (JP)
NAKAHARA AYUMU (JP)
NAKA KEISUKE (JP)
Application Number:
PCT/JP2012/066888
Publication Date:
January 24, 2013
Filing Date:
July 02, 2012
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
GUNZE KK (JP)
YASUI YOSHIKATSU (JP)
DOI MITSURU (JP)
NOZAKI TAKANORI (JP)
MARUICHI NAOYUKI (JP)
NAKAHARA AYUMU (JP)
NAKA KEISUKE (JP)
International Classes:
B32B27/36; B29C61/06; C09D5/02; C09D7/65; C09D167/00; C09D201/00; B29K67/00; B29K105/02; B29L9/00
Foreign References:
JP2011105788A2011-06-02
JP2005047958A2005-02-24
JP2002327149A2002-11-15
Attorney, Agent or Firm:
Tamura, Ryosuke (JP)
Ryosuke Tamura (JP)
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Claims: