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Patent Searching and Data


Title:
HEAT-SHRINKABLE MULTILAYER FILM
Document Type and Number:
WIPO Patent Application WO/2014/178379
Kind Code:
A1
Abstract:
This heat-shrinkable multilayer film is characterized in that: an outer-surface layer (A), which is located at an outer surface when content has been packed, comprises a polyester-based resin; an intermediate layer (B) comprises a polyamide-based resin; an inner-surface layer (D) comprises an ethylene-based copolymer having a melting point measured using differential scanning calorimetry (DSC) in accordance with JIS K7121 of 90-100˚C; and the adhesive strength between inner-surface layers after hot-water treatment at 80˚C is 0.1-3.5N/15mm. This polyamide-based heat-shrinkable multilayer film is provided with optimal properties for uses principally requiring strength, and is capable of achieving an excellent balance between self-welding properties and easy-peeling properties which is required for films used to package meat products such as fresh meat and processed meat.

Inventors:
ITOH TADAYOSHI
SEKIYA YUTA
TOBITA HISANORI
Application Number:
PCT/JP2014/061886
Publication Date:
November 06, 2014
Filing Date:
April 28, 2014
Export Citation:
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Assignee:
KUREHA CORP (JP)
International Classes:
B32B27/34; B32B27/28; B32B27/36
Domestic Patent References:
WO1999055528A11999-11-04
Foreign References:
JPS5814744A1983-01-27
JPH0796582A1995-04-11
JPS56129171A1981-10-09
JP4255215B22009-04-15
JPH1034800A1998-02-10
JP4848020B22011-12-28
Other References:
See also references of EP 2993041A4
Attorney, Agent or Firm:
TOKYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Tokyo international patent firm (JP)
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