Title:
HEAT SHRINKING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/139876
Kind Code:
A1
Abstract:
The present invention efficiently heats a shrink film while simplifying device configuration. A heat shrinking device according to an aspect of the present invention is provided with: a heating tunnel (3) provided over a transfer path (2a) of a rotary transfer unit that transfers a container coated with a label, the heating tunnel (3) including heating furnaces (3a to 3l) that eject steam; and a raising/lowering unit (8) that raises and lowers the heating tunnel (3).
Inventors:
NAKAGAWA YUJI (JP)
KAWAUCHI YASUYUKI (JP)
KAWAUCHI YASUYUKI (JP)
Application Number:
PCT/JP2022/040345
Publication Date:
July 27, 2023
Filing Date:
October 28, 2022
Export Citation:
Assignee:
FUJI SEAL INT INC (JP)
International Classes:
B65B53/00; B65B53/02; B65B53/04
Foreign References:
| JP2018531847A | 2018-11-01 | |||
| JPH09175515A | 1997-07-08 | |||
| JP2020001812A | 2020-01-09 |
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