Title:
HEAT SINK, CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/002324
Kind Code:
A1
Abstract:
The present application relates to a heat sink, a circuit board module and an electronic device. The heat sink is configured for the heat dissipation of an electronic component. The heat sink comprises a base, a plurality of fins, and a positioning column, wherein the plurality of fins are all connected to the base, and the positioning column is connected to the base; a heat conduction face, which is configured to be fitted to an electronic component, is formed on the base; and the positioning column is located on the same side of the base as the heat conduction face, and is configured to connect to a circuit board. The function of fixing a heat sink is achieved by providing the positioning column in the heat sink and connecting same to the circuit board, thereby making the connection between the heat sink and the electronic component firmer.
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Inventors:
LI YANG (CN)
Application Number:
PCT/CN2023/104491
Publication Date:
January 04, 2024
Filing Date:
June 30, 2023
Export Citation:
Assignee:
BITMAIN TECH INC (CN)
International Classes:
H05K7/20; H05K1/02
Foreign References:
| CN209267853U | 2019-08-16 | |||
| CN217985815U | 2022-12-06 | |||
| CN214627473U | 2021-11-05 | |||
| CN101150101A | 2008-03-26 | |||
| CN110999562A | 2020-04-10 | |||
| CN213847398U | 2021-07-30 | |||
| US20130155624A1 | 2013-06-20 |
Attorney, Agent or Firm:
SHENZHEN LIDAO INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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