Title:
HEAT SINK AND ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/204077
Kind Code:
A1
Abstract:
Good heat dissipation performance is obtained through a simple and space-saving shape. The present invention comprises: a base part 10 of which one side surface serves as an electronic component contacting surface 11 and the reverse side surface serves as a heat dissipation surface 12; and two heat dissipation pieces 30 respectively provided on one end side and the other end side in a direction in which the heat dissipation surface 12 is continuous on the base part 10, wherein the two heat dissipation pieces 30 each have a side wall part 31 projecting from the heat dissipation surface 12 and a top wall part 32 projecting from the projection end side of the side wall part 31 toward the other heat dissipation piece 30 such that an outer space S1 is maintained between the top wall part 32 and the heat dissipation surface 12, and the two top wall parts 32 are separated such that a ventilation passage A connecting an inner space S2 and the outer space S1 is maintained therebetween.
Inventors:
NAKAMURA YOUSUKE (JP)
MATSUURA SHU (JP)
MATSUURA SHU (JP)
Application Number:
PCT/JP2020/015042
Publication Date:
October 08, 2020
Filing Date:
April 01, 2020
Export Citation:
Assignee:
KAGA INC (JP)
International Classes:
H01L23/36; H05K7/20
Domestic Patent References:
| WO2018003138A1 | 2018-01-04 | |||
| WO2014020748A1 | 2014-02-06 |
Foreign References:
| JP2014063836A | 2014-04-10 | |||
| CN208210572U | 2018-12-07 | |||
| JPS59103496U | 1984-07-12 |
Attorney, Agent or Firm:
EICHI PATENT & TRADEMARK CORP. (JP)
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