Title:
HEAT SINK OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2004/061956
Kind Code:
A1
Abstract:
A heat sink for cooling an electronic component by bringing the heat sink into tight contact with the electronic component mounted on a circuit board through a resilient member fixed thereto, wherein the heat sink comprises a plurality of protrusions while the resilient member comprises a part engaging with the protrusion of the heat sink, and a hole part being inserted with the heat sink, characterized in that a pressure is applied from the resilient member to the heat sink when the heat sink is turned and the protrusion engages with the engaging part thus bringing the bottom face of the heat sink into tight contact with the electronic component.
Inventors:
TANAKA HIRONORI (JP)
SATO YOSHIYUKI (JP)
TAKANO WATARU (JP)
ZENITANI HIDEKI (JP)
HAYASHI MITUAKI (JP)
NISHIDA KAZUYA (JP)
IKEDA KATSUHIKO (JP)
SATO YOSHIYUKI (JP)
TAKANO WATARU (JP)
ZENITANI HIDEKI (JP)
HAYASHI MITUAKI (JP)
NISHIDA KAZUYA (JP)
IKEDA KATSUHIKO (JP)
Application Number:
PCT/JP2002/013850
Publication Date:
July 22, 2004
Filing Date:
December 27, 2002
Export Citation:
Assignee:
FUJITSU LTD (JP)
TANAKA HIRONORI (JP)
SATO YOSHIYUKI (JP)
TAKANO WATARU (JP)
ZENITANI HIDEKI (JP)
HAYASHI MITUAKI (JP)
NISHIDA KAZUYA (JP)
IKEDA KATSUHIKO (JP)
TANAKA HIRONORI (JP)
SATO YOSHIYUKI (JP)
TAKANO WATARU (JP)
ZENITANI HIDEKI (JP)
HAYASHI MITUAKI (JP)
NISHIDA KAZUYA (JP)
IKEDA KATSUHIKO (JP)
International Classes:
H01L23/40; H05K7/20; (IPC1-7): H01L23/40
Foreign References:
| JPH04284654A | 1992-10-09 | |||
| JPH04264760A | 1992-09-21 | |||
| JPH09298259A | 1997-11-18 | |||
| US5375652A | 1994-12-27 |
Attorney, Agent or Firm:
Itoh, Tadahiko (Yebisu Garden Place Tower 20-3, Ebisu 4-chom, Shibuya-ku Tokyo, JP)
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