HEAT TRANSFER MEMBER, AND HEAT TRANSFER ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME

WIPO Patent Application WO/2023/153917

A1

A heat transfer member is provided. A heat transfer member according to one embodiment of the present invention comprises a carbon-based sheet having an x-y plane, wherein the carbon-based sheet includes: a heat transfer unit including a first part and a second part that are spaced apart from each other in an x-axis direction; and a shape deformation unit, located between the first part and the second part, that is bent by an external force which is applied so as to make the first part and the second part have different heights or plane directions. Due to this feature, the heat transfer member has excellent bending characteristics capable of connecting structures which are located on different planes or spaced apart from each other with a different in height without causing damage such as cracks. In addition, since the heat transfer member has excellent heat transfer characteristics, the heat transfer member can transfer heat very quickly from a structure having a heat source to another spaced-apart structure and release the heat to the outside, thereby minimizing performance degradation of an electronic device caused by heat generation.

LEE HYO-JUNG (KR)
JEONG UI-YOUNG (KR)
JANG GEUNYOUNG (KR)
LEE GYU MIN (KR)
SEO IN-YONG (KR)
KIM JIN HAN (KR)
KIM KYUNG SU (KR)

PCT/KR2023/095004

August 17, 2023

February 08, 2023

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AMOGREENTECH CO LTD (KR)

H05K7/20; B32B9/00

KR20210116893A	2021-09-28
KR20210088971A	2021-07-15
KR20210142919A	2021-11-26
US20210168929A1	2021-06-03
US20210083210A1	2021-03-18

ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)

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