Title:
HEAT-TRANSFER-MEMBER-EQUIPPED SUBSTRATE AND PRODUCTION METHOD FOR HEAT-TRANSFER-MEMBER-EQUIPPED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/084897
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the thermal performance of a heat-generating component. A heat-transfer-member-equipped substrate that comprises a substrate, a heat transfer member that is provided in a through hole in the substrate, a heat-generating component, and a solder part at which the heat-generating component is soldered onto one end surface of the heat transfer member. A nickel base plating layer is formed on at least the one end surface of the heat transfer member, a gold plating layer that suppresses the oxidation of the nickel base plating layer is mixed with the solder part, and the solder part is bonded to the nickel base plating layer. The heat transfer member comprises a first heat transfer part and a second heat transfer part that is bonded to the first heat transfer part. The first heat transfer part is formed from copper or a copper alloy. The second heat transfer part is formed from aluminum or an aluminum alloy. An alumite coating film is formed on at least a portion of the surface of the second heat transfer part. The second heat transfer part is formed in the shape of a plate that protrudes beyond the periphery of the first heat transfer part.
Inventors:
HARAGUCHI AKIRA (JP)
Application Number:
PCT/JP2020/033256
Publication Date:
May 06, 2021
Filing Date:
September 02, 2020
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K7/20; H01L23/36; H05K1/02
Foreign References:
| JP2011159702A | 2011-08-18 | |||
| JP2012099540A | 2012-05-24 | |||
| JP2014135418A | 2014-07-24 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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