Title:
HEAT TRANSFER PLATE
Document Type and Number:
WIPO Patent Application WO/2024/024235
Kind Code:
A1
Abstract:
This heat transfer plate 100 comprises a base material 1 made of metal and having a first groove section 10 and a second groove section 20 that is recessed from the first groove section 10, and an engagement member 3 composed of a metal and engaging with the first groove section 10, wherein: the first groove section 10 comprises a pair of first side surfaces 11, 11 that fall from the surface of the base material 1 and face each other; the second groove section 20 comprises a second bottom surface 22 that constitutes the bottom of the second groove section 20, and a pair of second side surfaces 21, 21 that rise from the second bottom surface 22 and face each other; the distance between the pair of second side surfaces 21, 21 is less than the distance between the first side surfaces 11, 11; among the pair of second side surfaces 21, 21, one second side surface bulges toward the other second side surface; and a facing surface 31 which is in the engagement member 3 and faces the second bottom surface 22 bulges toward the second bottom surface 22.
Inventors:
KUWATA HIDENORI (JP)
Application Number:
PCT/JP2023/019058
Publication Date:
February 01, 2024
Filing Date:
May 23, 2023
Export Citation:
Assignee:
UACJ FOUNDRY & FORGING CORP (JP)
International Classes:
F28F3/12
Domestic Patent References:
| WO2015093619A1 | 2015-06-25 |
Foreign References:
| JP2006342367A | 2006-12-21 | |||
| US20120291997A1 | 2012-11-22 | |||
| US20040112572A1 | 2004-06-17 | |||
| JP2000018867A | 2000-01-18 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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