Title:
HEAT TRANSFER SHEET, COMBINATION OF HEAT TRANSFER SHEET AND BODY TO BE TRANSFERRED, METHOD FOR MANUFACTURING HEAT TRANSFER SHEET, AND METHOD FOR MANUFACTURING TRANSFER ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/114125
Kind Code:
A1
Abstract:
A heat transfer sheet comprising a substrate and a transfer layer releasably provided on the substrate by thermal transfer, in the stated order in the thickness direction, wherein the transfer layer comprises an electroconductive layer or metal-containing layer and an adhesive layer, the adhesive layer containing at least one type of component selected from a modified polyolefin and an ionomer, and the electroconductive layer or metal-containing layer constituting a substrate-side surface layer of the transfer layer.
Inventors:
IKEDA MEGUMI (JP)
HATTORI RYOJI (JP)
HATTORI RYOJI (JP)
Application Number:
PCT/JP2021/043386
Publication Date:
June 02, 2022
Filing Date:
November 26, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/32; B32B7/025; B32B7/06; B41M5/385; B41M5/44; H01Q1/38
Foreign References:
| JP2016112726A | 2016-06-23 | |||
| JP2000272258A | 2000-10-03 | |||
| JPH0958141A | 1997-03-04 | |||
| JPH09226260A | 1997-09-02 | |||
| JP2009090520A | 2009-04-30 | |||
| JP2018114661A | 2018-07-26 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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