HEAT TRANSPORT SYSTEM

WIPO Patent Application WO/2016/047017

A1

This heat transport system is provided with: a first circuit (1) in which a first heat carrier circulates; and a second circuit (2, 3) in which a second heat carrier circulates. The first circuit has a first heat source (11) that generates heat, and a first radiator (12) that radiates heat to the outside of the system. The second circuit has an evaporator (24, 31) that generates cold due to the evaporation of the second heat carrier, and a second radiator (22, 32, 36) that radiates heat from the evaporated second heat carrier in gaseous form. In the second radiator, the first heat carrier is heated by the heat radiated from the second heat carrier. The first heat carrier is composed of a solution containing at least one solute (60). The solute is composed of molecules, each provided with: a first portion (61) that is selectively brought close to the solid-liquid interface of a solvent if the temperature of the heat carrier falls to a predetermined reference temperature or less; and a second portion (62) that is connected to the first portion (61) and solvophobic to the solvent.

FUSE TAKUYA (JP)
KANEKO TAKASHI (JP)
KAWAGUCHI TOURU (JP)

PCT/JP2015/003901

March 31, 2016

August 03, 2015

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DENSO CORP (JP)

F25B1/00; B60K11/02; C09K5/04; C09K5/20; F25B17/02; F25B17/08; F28D20/00

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JPH09194817A	1997-07-29
JP2012214104A	2012-11-08
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JPH03225162A	1991-10-04
JP2013139959A	2013-07-18
JPH10246529A	1998-09-14
JP2010127282A	2010-06-10
JP2012091547A	2012-05-17

KIN, Junhi (JP)
Gold Junki (JP)

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