Title:
HEAT UTILIZATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/171465
Kind Code:
A1
Abstract:
Provided is a heat utilization device in which thermal resistance of a wiring layer 10 is increased while an increase in electrical resistance of the wiring layer is suppressed. A heat utilization device 1 has a thermistor 7 in which the electrical resistance thereof varies according to temperature, and a wiring layer 10 connected to the thermistor 7. The mean free path of phonons in the wiring layer 10 is smaller than the mean free path of phonons in an infinite medium comprising the material of the wiring layer 10.
Inventors:
HARA SHINJI (JP)
OHTA NAOKI (JP)
AOKI SUSUMU (JP)
KOMURA EIJI (JP)
KAIZU AKIMASA (JP)
OHTA NAOKI (JP)
AOKI SUSUMU (JP)
KOMURA EIJI (JP)
KAIZU AKIMASA (JP)
Application Number:
PCT/JP2018/008556
Publication Date:
September 12, 2019
Filing Date:
March 06, 2018
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
G01J1/02
Domestic Patent References:
| WO2008068386A1 | 2008-06-12 |
Foreign References:
| US20170199082A1 | 2017-07-13 | |||
| JP2007316076A | 2007-12-06 | |||
| JPH10332480A | 1998-12-18 | |||
| JP2009194085A | 2009-08-27 | |||
| JP2017223644A | 2017-12-21 | |||
| JP2011237256A | 2011-11-24 | |||
| JP2009229260A | 2009-10-08 | |||
| JP2013050365A | 2013-03-14 |
Attorney, Agent or Firm:
MIYAZAKI Teruo et al. (JP)
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