Title:
HEATABLE FLOOR STRUCTURE AND METHOD OF CONSTRUCTING THE SAME
Document Type and Number:
WIPO Patent Application WO/2005/005749
Kind Code:
A1
Abstract:
A heatable floor structure that can be constructed without screwing or nailing to an existing floor of a building (house) and a method of constructing the floor structure. The heatable floor structure has a heater panel (4) provided on an existing floor (1) surface of a building and a surface covering material (8) provided on the heater panel. In the heater panel (4), a heat medium tube is embedded in an embedding groove cut in the surface side and a flexible thin plate is adhered on the upper side of the tube. To the heater panel (4) is applied a load capable of sufficiently restricting positional displacement and lift, relative to the existing floor (1) surface, of the panel.
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Inventors:
INOUE MICHIAKI (JP)
KUGA TAKESHI (JP)
INOKUCHI YUKIO (JP)
KUGA TAKESHI (JP)
INOKUCHI YUKIO (JP)
Application Number:
PCT/JP2004/009974
Publication Date:
January 20, 2005
Filing Date:
July 13, 2004
Export Citation:
Assignee:
MITSUBISHI CHEM FUNCTIONAL PRO (JP)
INOUE MICHIAKI (JP)
KUGA TAKESHI (JP)
INOKUCHI YUKIO (JP)
INOUE MICHIAKI (JP)
KUGA TAKESHI (JP)
INOKUCHI YUKIO (JP)
International Classes:
F24D3/16; (IPC1-7): E04F15/18; E04G23/02; F24D3/16
Foreign References:
| JP2000199332A | 2000-07-18 | |||
| JPH10264280A | 1998-10-06 | |||
| JP2002030791A | 2002-01-31 |
Attorney, Agent or Firm:
Okada, Kazuhiko (Kudan Kangyo Bldg. 6F 10-1, Kudan-Kita 1-chom, Chiyoda-ku Tokyo 73, JP)
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