Title:
HEATER CHIP, BONDING DEVICE, AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/038282
Kind Code:
A1
Abstract:
To provide a heater chip having an iron part with superior conductivity and heat generating properties, said heater chip being capable of performing processing for bonding conduction wires and terminal members efficiently, stably, and reliably. A heater chip (10) has a soldering iron part (12) positioned at the lowest end when the heater chip (10) is in a normal usage orientation and a pair of connection terminals (14L, 14R) extending symmetrically or asymmetrically upward from the left and right ends integrally with the soldering iron part (12). The soldering iron part (12) has a cross sectional area equal to or less than the cross sectional area of both of the connection terminals (14L, 14R) over the path of current flowing inside the heater chip when energized. A recess (18) is formed at one side surface (12b) of the soldering iron part (12). A thermoelectric couple (24) is attached to a rear surface (12c) of the soldering iron part (12) with a protrusion (22) interposed therebetween.
Inventors:
HARADA SHINICHI (JP)
Application Number:
PCT/JP2016/071155
Publication Date:
March 09, 2017
Filing Date:
July 19, 2016
Export Citation:
Assignee:
KOBO PDA CO LTD (JP)
International Classes:
B23K20/00; B23K1/00; B23K3/04; H01L21/60; B23K101/40
Foreign References:
| JP2012183552A | 2012-09-27 | |||
| JP2010253503A | 2010-11-11 | |||
| JP2009160617A | 2009-07-23 | |||
| JP2007123647A | 2007-05-17 | |||
| JP2013099779A | 2013-05-23 |
Attorney, Agent or Firm:
SEISHIN IP PATENT FIRM, P.C. (JP)
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