Title:
HEATER CHIP FOR THERMOCOMPRESSION BONDING
Document Type and Number:
WIPO Patent Application WO/2005/018861
Kind Code:
A1
Abstract:
A heater chip for thermocompression bonding, where the degree of heating at a thermocompression bonding part does not vary among individual heater chips and durability is enhanced. In a heater chip for thermocompression bonding, a small projection-like thermocompression bonding portion (2) heating up by conduction resistance is provided on a small plate-like body (1), on the head end side having a reduced width. A cut (3) is provided in the body, from the base end side toward the vicinity of the thermocompression bonding portion. Each of both sides of the cut serves as a conducting terminal portion (1a, 1b). A thermocouple (5) for temperature detection is installed in the vicinity of the thermocompression bonding portion (2). A projection portion (7) for thermo-welding a temperature detection portion of the thermocouple is provided on an inner side surface of the cut or on the outer peripheral side surface of the body.
Inventors:
ISHII TATSUYA (JP)
Application Number:
PCT/JP2004/004008
Publication Date:
March 03, 2005
Filing Date:
March 24, 2004
Export Citation:
Assignee:
KOBO PDA CO LTD (JP)
ISHII TATSUYA (JP)
ISHII TATSUYA (JP)
International Classes:
B23K3/04; B23K20/02; (IPC1-7): B23K3/047
Domestic Patent References:
| WO2003097288A1 | 2003-11-27 |
Foreign References:
| JP2001284781A | 2001-10-12 | |||
| JPS56129393A | 1981-10-09 |
Attorney, Agent or Firm:
Matsunami, Yoshifumi c/o Matsunami, Patent Attorneys Office 19-4 (Chiyoda 2-chome Naka-ku, Nagoya-shi Aichi, JP)
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