Title:
HEATER DEVICE AND OPTICAL ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2021/044962
Kind Code:
A1
Abstract:
A heater device (101) is provided with: a flexible substrate (2); a heater (1a) disposed on the surface of or inside the flexible substrate (2); and a temperature sensor (3) disposed at a position apart from the heater (1a) on the surface of or inside the flexible substrate (2).
Inventors:
NAKATSUKA HITOSHI (JP)
Application Number:
PCT/JP2020/032563
Publication Date:
March 11, 2021
Filing Date:
August 28, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
G03B15/00; G02B7/02; G03B17/55; H05B3/34
Domestic Patent References:
| WO2017046962A1 | 2017-03-23 |
Foreign References:
| JP2003257826A | 2003-09-12 | |||
| JP2012202971A | 2012-10-22 | |||
| JP2018151283A | 2018-09-27 | |||
| JP2012216574A | 2012-11-08 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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