HEATER, REFLOW APPARATUS, AND SOLDER BUMP FORMING METHOD AND APPARATUS

Title:

HEATER, REFLOW APPARATUS, AND SOLDER BUMP FORMING METHOD AND APPARATUS

Document Type and Number:

WIPO Patent Application WO/2005/096367

Kind Code:

A1

Abstract:

An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side. With the former feature, oxidization of the solder paste on the substrate where no hot air comes and adhesion of particles to the substrate can be prevented, and with the latter feature, solder particles near the pad electrode are melted earlier and wet and spread over the pad electrode, solder particles above and far from the pad electrode are not melted sufficiently, and an effect of reducing the possibility that solder particles join together can be expected.

Inventors:

SHIRAI MASARU (JP)
ONOZAKI JUNICHI (JP)
SAITO HIROSHI (JP)
SAKAMOTO ISAO (JP)
FURUNO MASAHIKO (JP)
ANDO HARUHIKO (JP)
HIRATSUKA ATSUSHI (JP)

Application Number:

PCT/JP2005/005909

Publication Date:

October 13, 2005

Filing Date:

March 29, 2005

Export Citation:

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Assignee:

TAMURA SEISAKUSHO KK (JP)
JAPAN SCIENCE & TECH AGENCY (JP)
SHIRAI MASARU (JP)
ONOZAKI JUNICHI (JP)
SAITO HIROSHI (JP)
SAKAMOTO ISAO (JP)
FURUNO MASAHIKO (JP)
ANDO HARUHIKO (JP)
HIRATSUKA ATSUSHI (JP)

International Classes:

B23K1/012; B23K3/06; F27B17/00; F27D7/02; H01L21/48; H01L23/12; H01L21/60; H05K3/34; (IPC1-7): H01L21/60; F27D7/02; H01L23/12; H05K3/34

Foreign References:

JPH1168303A	1999-03-09
JPH11251737A	1999-09-17
JP2001068848A	2001-03-16
JP2000094179A	2000-04-04
JPS5092257A	1975-07-23

Other References: