Title:
HEATING APPARATUS IN SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/204051
Kind Code:
A1
Abstract:
Disclosed are a heating apparatus in a semiconductor device and a semiconductor device, the apparatus comprising: a heating body, which is used for carrying a chip, a heating member used for generating heat being disposed in the heating body; and a cooling structure, which is disposed below the heating body and is provided to selectively perform heat exchange with the heating body at locations at different distances from the heating body. The heating apparatus in a semiconductor device and the semiconductor device disclosed by the present invention are used for expanding the usage temperature range of the heating apparatus so as to meet different temperature requirements.
Inventors:
LI BING (CN)
Application Number:
PCT/CN2021/084863
Publication Date:
October 14, 2021
Filing Date:
April 01, 2021
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H05B3/28; C23C14/54; H01L21/67; H05B3/18
Foreign References:
| CN111477569A | 2020-07-31 | |||
| JP2019075219A | 2019-05-16 | |||
| JP2005150506A | 2005-06-09 | |||
| CN1297670A | 2001-05-30 | |||
| CN106567042A | 2017-04-19 | |||
| JP2005015820A | 2005-01-20 | |||
| CN110875167A | 2020-03-10 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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