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Patent Searching and Data


Title:
HEATING ASSEMBLY AND ELECTRONIC ATOMIZATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/127651
Kind Code:
A1
Abstract:
A heating assembly (11) and an electronic atomization device. The heating assembly (11) comprises a porous ceramic matrix (13), a heating layer (14) and a first dielectric layer (15); the heating layer (14) is attached to the porous ceramic matrix (13); the first dielectric layer (15) is attached to the surface of the heating layer (14) distant from the porous ceramic matrix (13); the first dielectric layer (15) comprises a glass phase and an inorganic non-metallic material of a non-glass phase. By disposing the first dielectric layer (15) on the surface of the heating layer (14) distant from the porous ceramic matrix (13), the matrix to be atomized is prevented from making contact with the heating layer (14), the corrosion of the substrate on the heating layer (14) is greatly reduced, the service life of the heating assembly (11) is prolonged, and the service life of the electronic atomization device is further prolonged. Moreover, because the first dielectric layer (15) prevents corrosion of the matrix on the heating layer (14), the heating layer (14) can be made of a material free of harmful heavy metal, so that the potential safety hazard caused by the material of the heating layer (14) in the heating assembly (11) on a user of the electronic atomization device is reduced to the maximum extent.

Inventors:
CHEN PENG (CN)
ZHENG LIANGFU (CN)
WU ZHENXING (CN)
JIANG JINFENG (CN)
DU JING (CN)
BU GUIHUA (CN)
XIE JIANSHENG (CN)
Application Number:
PCT/CN2021/136170
Publication Date:
June 23, 2022
Filing Date:
December 07, 2021
Export Citation:
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Assignee:
SHENZHEN SMOORE TECHNOLOGY LTD (CN)
International Classes:
A24F40/46; A24F40/40; H01B3/08
Foreign References:
CN110074469A2019-08-02
CN106847375A2017-06-13
CN110037355A2019-07-23
CN107068244A2017-08-18
CN111035073A2020-04-21
CN209749814U2019-12-10
US20200374985A12020-11-26
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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