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Patent Searching and Data


Title:
HEATING DEVICE AND METHOD FOR MANUFACTURING PLATE-SHAPED MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/056223
Kind Code:
A1
Abstract:
Provided are a heating device, and a method for manufacturing a plate-shaped member, with which it is possible to uniformly heat an object to be heated. The heating device 1 is provided with: a heater 10 for generating heat to be applied to a member W to be heated; and a support member 20 for supporting a surface Wf of the member W to be heated, the support member 20 being provided to a surface 11f of the heater 10. The support member 20 supports the member W to be heated so that heat is not directly conducted between the surface Wf of the member W to be heated and the support member 20, and so that the gap between the surface 11f and the surface Wf of the member W to be heated is kept at a prescribed spacing S at which a fluid is present in the gap but does not undergo convection. In the method for manufacturing a plate-shaped member, a member W to be heated is supported by a support member 20, the member W to be heated is heated by a heater 10, and a plate-shaped member is manufactured.

Inventors:
SHINOHARA SHINICHI (JP)
SUZUKI TAKAYUKI (JP)
MATSUDA JUN (JP)
NAGAHAMA MASANOBU (JP)
OKUBO TATSUO (JP)
OZAWA NAOTO (JP)
Application Number:
PCT/JP2017/033555
Publication Date:
March 29, 2018
Filing Date:
September 15, 2017
Export Citation:
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Assignee:
ORIGIN ELECTRIC (JP)
International Classes:
H05B3/68; B23K1/005; B23K1/008; B23K3/04; B23K31/02; H05B3/06; H05B3/10; B23K101/42
Domestic Patent References:
WO2009022590A12009-02-19
Foreign References:
JP2004533098A2004-10-28
JP2014143304A2014-08-07
Other References:
See also references of EP 3367750A4
Attorney, Agent or Firm:
MIYAGAWA, Teiji et al. (JP)
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