Title:
HEATING ELEMENT COOLING STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/096336
Kind Code:
A1
Abstract:
A heating element cooling structure and a method for manufacturing same are disclosed. Provided according to an embodiment of the present disclosure is a method for manufacturing a heating element cooling structure, the method comprising: a step of manufacturing an upper plate, which includes a plurality of column units, by using a press die; a step of manufacturing a lower plate by using the press die; a wick unit formation step of forming a wick unit at one or more of the inner surface of the upper plate and the inner surface of the lower plate by using a laser; and a step of bonding the upper plate and the lower plate to each other.
Inventors:
LEE KANG HYUN (KR)
KIM HYUNG SEOK (KR)
CHO HANG HYEON (KR)
LEE JONG MIN (KR)
JANG JAE HO (KR)
KIM HYUNG SEOK (KR)
CHO HANG HYEON (KR)
LEE JONG MIN (KR)
JANG JAE HO (KR)
Application Number:
PCT/KR2022/018597
Publication Date:
June 01, 2023
Filing Date:
November 23, 2022
Export Citation:
Assignee:
KMW INC (KR)
International Classes:
H01L23/427; G06F1/20
Domestic Patent References:
| WO2021133970A1 | 2021-07-01 |
Foreign References:
| JP3050180U | 1998-06-30 | |||
| KR101007174B1 | 2011-01-12 | |||
| JP5740036B1 | 2015-06-24 | |||
| JP2016188734A | 2016-11-04 |
Attorney, Agent or Firm:
LEE, Chulhee (KR)
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