Title:
HEATING FLOOR
Document Type and Number:
WIPO Patent Application WO/2006/054335
Kind Code:
A1
Abstract:
A heating floor initially heating at a very high rate, having high heat efficiency, capable of eliminating permanent deformation despite the fact that thin sheet-like bodies are used to reduce the overall thickness thereof to 18 mm or thinner so as to reduce running cost, and having excellent soundproofness. The heating floor comprises sheet-like body layers with thicknesses of 1 to 8 mm and a mat layer formed of a hard foam body in which a fluid pipe is assembled. The overall thickness of the heating floor is 18 mm or thinner. The compressive yield stress of the hard foam body measured under the conditions of an ordinary temperature and a compressibility of 10 mm/min according to JIS K 7220 is 0.5 MPa or higher.
Inventors:
OKABE MASASHI (JP)
ASHIZUKA RYOSUKE (JP)
UNE SOICHI (JP)
HAGINO TOMOKAZU (JP)
KAWASAKI SYOHEI (JP)
MORITAKE HIROSHI (JP)
ASHIZUKA RYOSUKE (JP)
UNE SOICHI (JP)
HAGINO TOMOKAZU (JP)
KAWASAKI SYOHEI (JP)
MORITAKE HIROSHI (JP)
Application Number:
PCT/JP2004/017026
Publication Date:
May 26, 2006
Filing Date:
November 16, 2004
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
OKABE MASASHI (JP)
ASHIZUKA RYOSUKE (JP)
UNE SOICHI (JP)
HAGINO TOMOKAZU (JP)
KAWASAKI SYOHEI (JP)
MORITAKE HIROSHI (JP)
OKABE MASASHI (JP)
ASHIZUKA RYOSUKE (JP)
UNE SOICHI (JP)
HAGINO TOMOKAZU (JP)
KAWASAKI SYOHEI (JP)
MORITAKE HIROSHI (JP)
International Classes:
F24D3/16
Foreign References:
| JP2001132218A | 2001-05-15 | |||
| JP2000344928A | 2000-12-12 | |||
| JP2004042500A | 2004-02-12 | |||
| JP2001336278A | 2001-12-07 | |||
| JPH11138564A | 1999-05-25 | |||
| JPH094864A | 1997-01-10 | |||
| JP2004061060A | 2004-02-26 | |||
| JP2004278964A | 2004-10-07 | |||
| JPH10212819A | 1998-08-11 | |||
| JPH07279381A | 1995-10-27 | |||
| JPH01134812U | 1989-09-14 |
Attorney, Agent or Firm:
Yasutomi, Yasuo (Nishinakajima 5-chome Yodogawa-ku, Osaka-sh, Osaka 11, JP)
Download PDF: