HEATING AND MELTING TREATMENT DEVICE AND HEATING AND MELTING TREATMENT METHOD

Title:

HEATING AND MELTING TREATMENT DEVICE AND HEATING AND MELTING TREATMENT METHOD

Document Type and Number:

WIPO Patent Application WO/2011/024813

Kind Code:

A1

Abstract:

Disclosed is a heating and melting treatment device which is capable of directly cooling an object to be treated, and which eliminates the need to dispose an additional cooling plate. Specifically disclosed is a heating and melting treatment device (1) which applies an object (100) to be treated including solder to heating and melting treatment in an atmosphere including carboxylic acid vapor, wherein a hand section (4) for carrying the object (100) to be treated, which has been applied to the heating and melting treatment thereon is also used as a cooling plate.

Inventors:

ABE HIDEYUKI (JP)

Application Number:

PCT/JP2010/064299

Publication Date:

March 03, 2011

Filing Date:

August 24, 2010

Export Citation:

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Assignee:

AYUMI INDUSTRY CO LTD (JP)
ABE HIDEYUKI (JP)

International Classes:

B23K1/008; B23K1/00; B23K3/00; B23K3/04; B23K31/02; H01L21/60; H05B3/14; H05K3/34; B23K101/40; B23K101/42

Domestic Patent References:

WO2007137547A1

2007-12-06

Foreign References:

JP2001244618A	2001-09-07
JP2009164523A	2009-07-23
JP2008034746A	2008-02-14
JP2008041980A	2008-02-21
JP2009164435A	2009-07-23
JPH11233934A	1999-08-27
JP2001244618A	2001-09-07

Other References: