HEATING MODULE, HEAT DISSIPATION APPARATUS, AND COMMUNICATION DEVICE

WIPO Patent Application WO/2023/226745

A1

The present application provides a heating module, a heat dissipation apparatus, and a communication device. The heating module comprises a housing, a first heating component, and a floating cover plate. The first heating component is arranged in the housing, the housing is provided with an opening, and the floating cover plate is provided with a first protrusion. The first protrusion can extend into the opening. The floating cover plate is installed on the housing by means of a first elastic member, and the first elastic member drives the first protrusion to apply first pressure to the first heating component. That is, under the driving of the first elastic member, the floating cover plate has certain pre-tightening force, so that the first protrusion is closely attached to the first heating component, and the heat dissipation efficiency of the first heating component can thus be improved, thereby improving the heat dissipation efficiency of the entire heating module, and prolonging the service life of the heating module. The first heating component is stably fixed to the housing by means of the floating cover plate, and is thus less likely to shake, so that improvement of the fixation reliability of the first heating component is facilitated, damage due to shaking is not prone to occurring, and the service life of the heating module is prolonged.

LI XIAODONG (CN)
LIN PEIQING (CN)
YAN TAO (CN)

PCT/CN2023/092973

November 30, 2023

May 09, 2023

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HUAWEI TECH CO LTD (CN)

H05K7/20

JP2022072518A	2022-05-17
CN110662389A	2020-01-07
CN103906411A	2014-07-02
CN107191816A	2017-09-22
CN112197820A	2021-01-08

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