Title:
HEATSINK SECURING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/157355
Kind Code:
A1
Abstract:
The present invention reduces the load on a soldered portion of an electronic component. This heatsink securing structure comprises: a heatsink (4) that is secured to a body portion (3A) of an electronic component (3) having a leg portion (3B) connected to a substrate (2) by soldering; a flexible mounting portion (1C) provided on a device body (1) to which the substrate (2) is secured; and a joint member (10) that joins the heatsink (4) and the mounting portion (1C).
Inventors:
SUGIYAMA DAISUKE (JP)
Application Number:
PCT/JP2022/033714
Publication Date:
August 24, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
JVCKENWOOD CORP (JP)
International Classes:
H05K7/20
Foreign References:
| JPS59107195U | 1984-07-19 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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