Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEATSINK
Document Type and Number:
WIPO Patent Application WO/2018/043312
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a heatsink capable of preventing an apparatus such as a power source device from receiving waste heat from the heatsink, in addition, allowing the dimension in the height direction of a lighting apparatus to be reduced, and furthermore, having a cooling function even when the working fluid in the heat pipe is frozen and does not operate due to being installed in cold climates. This heatsink comprises: a base plate thermally connected to an LED module at the back surface side center portion thereof; a heat pipe provided on the front surface side of the base plate, whereof the heat-receiving portion is disposed at a position overlapping with the LED module in a planar view; and a plurality of flat plate-shaped radiator fins thermally connected to the heat pipe. None of the radiator fins are disposed at the position overlapping with the LED module in a planar view, and at least one among the plurality of the radiator fins is in contact with the base plate.

Inventors:
UCHIMURA YASUHIRO (JP)
KATAYAMA TAKAHIRO (JP)
MURAKAMI GOUICHI (JP)
Application Number:
PCT/JP2017/030450
Publication Date:
March 08, 2018
Filing Date:
August 25, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
F21V29/503; F21V29/51; F21V29/74; F28D15/02; H01L23/427; H05K7/20
Domestic Patent References:
WO2012168845A12012-12-13
Foreign References:
US20100226138A12010-09-09
JP2015125871A2015-07-06
JP3146239U2008-11-06
JP2015144044A2015-08-06
US7674012B12010-03-09
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
Download PDF: