Title:
HEIGHT-ADJUSTABLE NEEDLE SYSTEM, REACTION CAVITY, AND SEMICONDUCTOR PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/029833
Kind Code:
A1
Abstract:
A height-adjustable needle system (10), a reaction cavity (20), and a semiconductor processing device. The system comprises a wafer lifting pin means (15) configured to rise to lift a wafer from a base or to descend to lower the wafer to the base, and further comprises a focus ring lifting pin means (11) configured to rise to lift a focus ring (12) from an initial position of the focus ring (12) so as to enable an inner ring region of the upper surface of the focus ring (12) to support an edge region of the wafer, or to descend to lower the focus ring (12) back to the initial position. By means of the technical solution regarding the system, the reaction cavity, and the device, the abnormal condition maintenance efficiency can be increased; in addition, the service life of the focus ring can be doubled, and the focus ring can be replaced without breaking the vacuum of the reaction cavity, so that the efficiency of replacing consumable parts can be increased.
Inventors:
MAO XINGFEI (CN)
Application Number:
PCT/CN2019/098370
Publication Date:
February 13, 2020
Filing Date:
July 30, 2019
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01L21/687; H01J37/32; H01L21/677; H01L21/683
Foreign References:
| CN109192696A | 2019-01-11 | |||
| US6044534A | 2000-04-04 | |||
| US5569350A | 1996-10-29 | |||
| CN101640181A | 2010-02-03 | |||
| JP2016046451A | 2016-04-04 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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