Title:
HETEROGENEOUS BONDED STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/093982
Kind Code:
A1
Abstract:
The present application belongs to the technical field of semiconductors. Disclosed are a heterogeneous bonded structure and a preparation method therefor, and an electronic device. The heterogeneous bonded structure comprises: a first substrate, a second substrate, a first intercalation layer formed on the first substrate, and a second intercalation layer formed on the second substrate, wherein the first intercalation layer and the second intercalation layer are combined in a bonded manner; and one of the first intercalation layer and the second intercalation layer has a groove-shaped symmetric pattern, and the groove-shaped symmetric pattern is configured to alleviate at least one of lattice stress and thermal stress. The groove-shaped symmetrical pattern can alleviate lattice mismatch and/or thermal mismatch between the first substrate and the second substrate, alleviate lattice stress and/or thermal stress of an interface, inhibit dislocated extension and migration of the interface, and improve the reliability and stability of the heterogeneous bonded structure. In addition, volatile substances generated during bonding annealing can be effectively discharged, thereby reducing interface voids and effectively increasing the yield of bonding.
Inventors:
WANG YUXI (CN)
YIN XIANG (CN)
ZUO ZHIYUAN (CN)
ZHAO JIA (CN)
KANG RUYAN (CN)
LI XUN (CN)
YIN XIANG (CN)
ZUO ZHIYUAN (CN)
ZHAO JIA (CN)
KANG RUYAN (CN)
LI XUN (CN)
Application Number:
PCT/CN2023/128264
Publication Date:
May 10, 2024
Filing Date:
October 31, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L21/60; H01L21/02
Foreign References:
| CN109950392A | 2019-06-28 | |||
| CN113078047A | 2021-07-06 | |||
| CN106611739A | 2017-05-03 | |||
| US20200343093A1 | 2020-10-29 | |||
| CN103247516A | 2013-08-14 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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