Title:
HETEROGENEOUS INTEGRATION MODULE COMPRISING THERMAL MANAGEMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/252037
Kind Code:
A3
Abstract:
Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.
Inventors:
REFAI-AHMED GAMAL (US)
RAMALINGAM SURESH (US)
CHANG KEN (US)
RAJ MAYANK (US)
XIE CHUAN (US)
FRANS YOHAN (US)
RAMALINGAM SURESH (US)
CHANG KEN (US)
RAJ MAYANK (US)
XIE CHUAN (US)
FRANS YOHAN (US)
Application Number:
PCT/US2021/021235
Publication Date:
March 17, 2022
Filing Date:
March 05, 2021
Export Citation:
Assignee:
XILINX INC (US)
International Classes:
H01L23/40; H01L23/367; H01L25/16; H01L23/473
Foreign References:
| US20150162307A1 | 2015-06-11 | |||
| US20170186665A1 | 2017-06-29 | |||
| US20160284624A1 | 2016-09-29 | |||
| US20100181665A1 | 2010-07-22 | |||
| US20150035134A1 | 2015-02-05 |
Attorney, Agent or Firm:
TABOADA, Keith (US)
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