Title:
HEXAGONAL BORON NITRIDE AGGLOMERATED PARTICLES, HEXAGONAL BORON NITRIDE POWDER, RESIN COMPOSITION, AND RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2022/186191
Kind Code:
A1
Abstract:
[Problem] To provide hexagonal boron nitride agglomerated particles and a hexagonal boron nitride powder, each of which can impart extremely high dielectric strength and heat conductivity to a resin composition produced by filling the hexagonal boron nitride agglomerate particles or the hexagonal boron nitride powder in a resin and can be reduced in the density thereof. [Solution] Provided are hexagonal boron nitride agglomerated particles which are agglomerated particles of primary particles of hexagonal boron nitride, and each of which has a longer diameter falling within the range from 5 to 10 μm, a (longer diameter)/(shorter diameter) ratio falling within the range from 1.0 to 1.3, and a degree of circularity falling within the range from 0.3 to 0.8, in which, in an image observed with an SEM at 10000-fold magnification, the largest diameter of the primary particles confirmed on the surfaces of the agglomerated particles is 4 μm or less. Also provided is a hexagonal boron nitride powder which comprises agglomerated particles of primary particles of hexagonal boron nitride, has a diameter (D50) of 5 to 150 μm at a cumulative volume frequency of 50% in a particle size distribution when measured by a wet-mode laser diffraction particle size distribution method, has a volume-based median pore diameter of 3.0 μm or less when measured by a mercury intrusion porosimetry method, and also has an impurity content of 500 ppm or less.
Inventors:
DAIKI SHOTA (JP)
FUJINAMI KYOUICHI (JP)
NAWATA TERUHIKO (JP)
YOSHIDA SATORU (JP)
FUJINAMI KYOUICHI (JP)
NAWATA TERUHIKO (JP)
YOSHIDA SATORU (JP)
Application Number:
PCT/JP2022/008571
Publication Date:
September 09, 2022
Filing Date:
March 01, 2022
Export Citation:
Assignee:
TOKUYAMA CORP (JP)
International Classes:
C01B21/064; C08K3/38; C08L63/02; C08L101/00; H01B3/00; H01B3/30; H01B17/56
Domestic Patent References:
| WO2020158758A1 | 2020-08-06 | |||
| WO2018123571A1 | 2018-07-05 |
Foreign References:
| JP2017222522A | 2017-12-21 | |||
| JP2019521064A | 2019-07-25 | |||
| JP2019218254A | 2019-12-26 | |||
| JP2017165609A | 2017-09-21 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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