Title:
HIGH ENERGY RAY-CURABLE COMPOSITION AND USE OF SAME
Document Type and Number:
WIPO Patent Application WO/2023/037942
Kind Code:
A1
Abstract:
[Problem] To provide a silicon-atom-containing high energy ray-curable composition, a cured product of which has high transparency and low dielectric properties, and which has low viscosity and excellent workability when applied to a base material even in cases where the composition is of solvent-free type. [Solution] A high energy ray-curable composition which is characterized by containing 5 parts by mass to 95 parts by mass of (A) a compound that has one or more (meth)acryloxy groups and no silicon atom in each molecule, and 95 parts by mass to 5 parts by mass of (B) a branched organopolysiloxane that has one (meth)acryloxy group and no alkoxy group in each molecule, while having some oxygen atoms being optionally substituted by a divalent alkylene group that has 6 or less carbon atoms, and which is also characterized by substantially containing no organic solvent in the composition and having a viscosity of the entire composition of 500 mPa∙s or less as determined with use of an E-type viscometer at 25°C; and a use of this high energy ray-curable composition.
Inventors:
OGAWA TAKUYA (JP)
HOSOKAWA TOMOKA (JP)
HOSOKAWA TOMOKA (JP)
Application Number:
PCT/JP2022/032783
Publication Date:
March 16, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08F230/08; C08F220/10; C09D4/02; C09D183/07
Foreign References:
| JPS60191039A | 1985-09-28 | |||
| JP2012508277A | 2012-04-05 | |||
| JPS5466853A | 1979-05-29 | |||
| JPH09189887A | 1997-07-22 | |||
| JP2000131655A | 2000-05-12 |
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