Title:
HIGH-FREQUENCY CIRCUIT BOARD, HIGH-FREQUENCY SEMICONDUCTOR PACKAGE USING SAME, AND HIGH-FREQUENCY SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/029942
Kind Code:
A1
Abstract:
A high-frequency circuit board provided with a dielectric substrate (1) and line conductors (3). The line conductors (3) are formed on the surface of the dielectric substrate (1), and each line conductor (3) has a connection end at one end, said connection end having wide sections (3a) in which the line width has been widened, and a narrow section (3b) disposed between a plurality of the wide sections (3a). A high-frequency circuit board in which the tolerance range for the accuracy of alignment between line conductors to be connected is large, while an increase in the capacitance component at the connection end is suppressed.
Inventors:
TSUJINO MAHIRO (JP)
Application Number:
PCT/JP2014/072149
Publication Date:
March 05, 2015
Filing Date:
August 25, 2014
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01P1/04; H01P3/08
Foreign References:
| JPH0685341B2 | 1994-10-26 | |||
| JP2702245B2 | 1998-01-21 | |||
| EP1555712A1 | 2005-07-20 |
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