Title:
HIGH-FREQUENCY CIRCUIT AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/058414
Kind Code:
A9
Abstract:
A high-frequency circuit (1A) that can perform uplink MIMO for a first band comprises a power amplifier (30) that can amplify signals in the first band, a first circuit that can adjust the linearity of the output power of power amplifier (30) relative to the input power, a power amplifier (40) that can amplify signals in the first band, and a second circuit that can adjust the linearity of the output power of power amplifier (40) relative to the input power. When uplink MIMO is performed using a first transmission signal that has been outputted from power amplifier (30) and a second transmission signal that has been outputted from power amplifier (40), the first circuit and the second circuit increase the saturated output power of the power amplifiers (30, 40).
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Inventors:
TANAKA SATOSHI (JP)
SAKURAI SATOSHI (JP)
MORI HIROTSUGU (JP)
SAKURAI SATOSHI (JP)
MORI HIROTSUGU (JP)
Application Number:
PCT/JP2022/034177
Publication Date:
June 01, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/04; H03F1/32; H03F3/24; H04B7/0413
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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