Title:
HIGH-FREQUENCY CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2002/056409
Kind Code:
A1
Abstract:
A dielectric substrate (51) is inserted into the air layer between a ground conductor (31) and a dielectric substrate (21), and a dielectric substrate (61) into the air layer between a ground conductor (41) and a dielectric substrate (21).
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Inventors:
OHWADA TETSU (JP)
UCHIDA HIROMITSU (JP)
OH-HASHI HIDEYUKI (JP)
MIYAZAKI MORIYASU (JP)
KURIHARA MANABU (JP)
CHATANI YOSHIYUKI (JP)
UCHIDA HIROMITSU (JP)
OH-HASHI HIDEYUKI (JP)
MIYAZAKI MORIYASU (JP)
KURIHARA MANABU (JP)
CHATANI YOSHIYUKI (JP)
Application Number:
PCT/JP2002/000100
Publication Date:
July 18, 2002
Filing Date:
January 10, 2002
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
OHWADA TETSU (JP)
UCHIDA HIROMITSU (JP)
OH-HASHI HIDEYUKI (JP)
MIYAZAKI MORIYASU (JP)
KURIHARA MANABU (JP)
CHATANI YOSHIYUKI (JP)
OHWADA TETSU (JP)
UCHIDA HIROMITSU (JP)
OH-HASHI HIDEYUKI (JP)
MIYAZAKI MORIYASU (JP)
KURIHARA MANABU (JP)
CHATANI YOSHIYUKI (JP)
International Classes:
H01P1/20; H01P1/203; H01P1/213; H01P3/08; H01P5/02; (IPC1-7): H01P3/08; H01P1/203
Foreign References:
| JPH05259720A | 1993-10-08 | |||
| JPS62292003A | 1987-12-18 |
Attorney, Agent or Firm:
Tazawa, Hiroaki (Kasumigaseki 3-chome Chiyoda-ku, Tokyo, JP)
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