HIGH FREQUENCY COMPONENT AND HIGH FREQUENCY CIRCUIT FOR USE THEREIN

Title:

HIGH FREQUENCY COMPONENT AND HIGH FREQUENCY CIRCUIT FOR USE THEREIN

Document Type and Number:

WIPO Patent Application WO/2008/018565

Kind Code:

A1

Abstract:

A high frequency circuit having a high frequency amplifier and an output matching circuit receiving high frequency power outputted from the high frequency amplifier is arranged in a multilayer substrate formed by laminating a plurality of dielectric layers to produce a high frequency component. The output matching circuit has a first transmission line for transmitting the high frequency power from the high frequency amplifier side to the output terminal side and at least a part of the first transmission line is formed by connecting, in series in the laminating direction, a plurality of conductor patterns formed over the plurality of dielectric layers.

Inventors:

HAYASHI KENJI (JP)
UCHIDA MASAYUKI (JP)

Application Number:

PCT/JP2007/065661

Publication Date:

February 14, 2008

Filing Date:

August 09, 2007

Export Citation:

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Assignee:

HITACHI METALS LTD (JP)
HAYASHI KENJI (JP)
UCHIDA MASAYUKI (JP)

International Classes:

H01P5/18; H04B1/44

Foreign References:

JP2006157093A	2006-06-15
JP2005277515A	2005-10-06
JP2005094795A	2005-04-07
JP2004241875A	2004-08-26
JP2004007585A	2004-01-08
JP2000223901A	2000-08-11
JP2006157095A	2006-06-15
JP2002300081A	2002-10-11
JP2004147166A	2004-05-20
JP2003324326A	2003-11-14

Other References: