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Title:
HIGH FREQUENCY DEVICE PACKAGES AND METHODS
Document Type and Number:
WIPO Patent Application WO2003073473
Kind Code:
A3
Abstract:
A high frequency device packing method and package (20) are described wherein coaxial structures are formed from the high frequency device (14) to the via. A coaxial via structure (3, 6) and a micro-coaxial bonding wire (9, 10, 17) are described.

Inventors:
PASTERNAK ELIEZER
CAHILL SEAN
HOM BANCE
Application Number:
PCT/US2003/005297
Publication Date:
November 27, 2003
Filing Date:
February 20, 2003
Export Citation:
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Assignee:
BRIDGEWAVE COMMUNICATIONS INC (US)
International Classes:
H01L23/055; H01L23/49; H01L23/66; H05K3/44; (IPC1-7): H05K1/11; H01R12/04
Foreign References:
US5847453A1998-12-08
US5622898A1997-04-22
US6191492B12001-02-20
US6465896B12002-10-15
US5421083A1995-06-06
US5685071A1997-11-11
US5323533A1994-06-28
US5576518A1996-11-19
US5949030A1999-09-07
US5405808A1995-04-11
US4959900A1990-10-02
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