Title:
HIGH-FREQUENCY DIELECTRIC ADHESIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/104932
Kind Code:
A1
Abstract:
Disclosed is a high-frequency dielectric adhesive material which suppresses degradation of a Q value of a high-frequency circuit and obtains a large adjustment effect. A high-frequency dielectric adhesive material (101) is a laminated body comprising an insulating sheet layer (11), an adhesive layer (12), a dielectric sheet layer (13), and peeling paper (14). The insulating sheet layer (11) forms the outermost layer and the adhesive layer (12), the dielectric sheet layer (13), and the peeling paper (14) are successively arranged underneath the insulating sheet layer (11). The width (W13) of the dielectric sheet layer (13) is less than the width (W11) of the insulating sheet layer (11) and the width (W12) of the adhesive layer (12), and the adhesive layer (12) protrudes in the width direction from the dielectric sheet layer (13). When the high-frequency dielectric adhesive material (101) is used, the peeling paper (14) is peeled off and the surface from which the peeling paper (14) has been peeled is adhered to a target object.
Inventors:
ONAKA KENGO (JP)
ISHIHARA TAKASHI (JP)
KASAI MASANORI (JP)
ISHIHARA TAKASHI (JP)
KASAI MASANORI (JP)
Application Number:
PCT/JP2010/068888
Publication Date:
September 01, 2011
Filing Date:
October 26, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
ONAKA KENGO (JP)
ISHIHARA TAKASHI (JP)
KASAI MASANORI (JP)
ONAKA KENGO (JP)
ISHIHARA TAKASHI (JP)
KASAI MASANORI (JP)
International Classes:
H01P1/203; B32B7/02; H01B17/60; H01P1/00; H01P3/08; H01Q1/38; H01Q5/10
Foreign References:
| JP2008112441A | 2008-05-15 | |||
| JP2008191927A | 2008-08-21 | |||
| JPH07504280A | 1995-05-11 | |||
| JP2005198168A | 2005-07-21 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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Claims: