Title:
HIGH FREQUENCY DIELECTRIC HEATING DEVICE FOR THERMOSETTING PLASTIC MATERIAL, AND METHOD FOR MOLDING THERMOSETTING PLASTIC
Document Type and Number:
WIPO Patent Application WO/2012/039382
Kind Code:
A1
Abstract:
Provided is a high frequency dielectric heating device for a thermosetting plastic material capable of heating more safely, more uniformly, and more rapidly compared to a device using microwave dielectric heating, and capable of forming a high quality thermosetting plastic. A high frequency dielectric heating device (1) can house a mold (M) in which a thermosetting plastic material is injected, and is provided with a high frequency wave generation unit (2) which generates high frequency waves so that the waves can be irradiated to the housed mold (M), and the thermosetting plastic material is subjected to dielectric heating by the irradiation of the high frequency waves to the mold (M). The high frequency wave generation unit (2) is provided with an electrode consisting of a lower electrode (4) and an upper electrode (5) which are arranged to supply high frequency waves to a carrying unit (3) which carries the mold (M).
Inventors:
HORIKOSHI SATOSHI (JP)
KATO SUMIO (JP)
KIDA FUMIO (JP)
KATO SUMIO (JP)
KIDA FUMIO (JP)
Application Number:
PCT/JP2011/071348
Publication Date:
March 29, 2012
Filing Date:
September 20, 2011
Export Citation:
Assignee:
SUNLUX OPTICAL CO LTD (JP)
HORIKOSHI SATOSHI (JP)
KATO SUMIO (JP)
KIDA FUMIO (JP)
HORIKOSHI SATOSHI (JP)
KATO SUMIO (JP)
KIDA FUMIO (JP)
International Classes:
B29C35/12; B29C39/02; B29C39/38; G02B3/00; B29K101/10; B29L11/00
Foreign References:
| JPH10337784A | 1998-12-22 | |||
| JP2007160688A | 2007-06-28 | |||
| JPS5210364A | 1977-01-26 | |||
| JPS5210365A | 1977-01-26 | |||
| JPH07112447A | 1995-05-02 |
Attorney, Agent or Firm:
ISHIDA YOSHIKI (JP)
Yoshiki Ishida (JP)
Yoshiki Ishida (JP)
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Claims: