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Title:
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/138386
Kind Code:
A1
Abstract:
A high frequency module (1) is provided with: a substrate (91) having a first major surface (91a) and a second major surface (91b) opposite each other; a first component (22) disposed on the first major surface (91a) of the substrate (91); a second component (21) disposed on the first component (22); a third component (24) disposed on the first major surface (91a) of the substrate (91); and a metal body (70) connected to ground. One end of the metal body (70) is connected to the first major surface (91a) of the substrate (91). The metal body (70), in plan view, is disposed between the first component (22) and the third component (24).

Inventors:
OSHIMA TAKAYUKI (JP)
Application Number:
PCT/JP2021/046338
Publication Date:
June 30, 2022
Filing Date:
December 15, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01L23/00; H01L23/28
Domestic Patent References:
WO2019098316A12019-05-23
WO2019181590A12019-09-26
Foreign References:
US20180261566A12018-09-13
JP2007188916A2007-07-26
JP2010161801A2010-07-22
JP2015111803A2015-06-18
JP2020102693A2020-07-02
JP2020113559A2020-07-27
JPH10125830A1998-05-15
JP2020102758A2020-07-02
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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