Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/100912
Kind Code:
A1
Abstract:
[Problem] To provide: a high-frequency module provided with an omnidirectional antenna and suitable for sending and receiving radio waves in a high-frequency band; and a communication device. [Solution] This high-frequency module is provided with: an antenna part provided so as to protrude from a substrate; an antenna element at least a portion of which is provided above the antenna part; a transmission line provided on the same surface as the antenna element and provided of the same material as the antenna element; and a high-frequency element mounted on the surface of the substrate on which the transmission line is formed.
Inventors:
SATO MASAHIRO (JP)
KAWAMURA TAKASHI (JP)
KAWAMURA TAKASHI (JP)
Application Number:
PCT/JP2017/037794
Publication Date:
June 07, 2018
Filing Date:
October 19, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01Q23/00; H01Q1/24; H01Q9/04; H04B1/38
Foreign References:
| JP2005027134A | 2005-01-27 | |||
| JPH07288415A | 1995-10-31 | |||
| JP2014220593A | 2014-11-20 | |||
| JP2005110109A | 2005-04-21 |
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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