Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/123972
Kind Code:
A1
Abstract:
A high-frequency module (2) for simultaneously transmitting and receiving a plurality of signals including at least a received signal in a first frequency band and a received signal in a second frequency band is provided with a first receiving circuit (21) which processes the received signal in the first frequency band. The first receiving circuit (21) includes: a first board; a first low-noise amplifier (211) mounted on a main surface of the first board; and a first filter circuit (212) which is connected to an output terminal of the first low-noise amplifier (211), and at least part of which is formed on the main surface of the first board. The first filter circuit (212) attenuates a spurious component which is generated by a transmission signal in the first frequency band being input into the first low-noise amplifier (211) and which is included in the transmission signal in the first frequency band and has a frequency band that overlaps the frequency band of the received signal in the second frequency band.
Inventors:
NANIWA YUSUKE (JP)
MUTO HIDEKI (JP)
MUTO HIDEKI (JP)
Application Number:
PCT/JP2017/046436
Publication Date:
July 05, 2018
Filing Date:
December 25, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H01P1/203; H01P5/02; H01P7/08; H04B1/10; H04B1/525
Foreign References:
| US20150214985A1 | 2015-07-30 | |||
| JP2007128939A | 2007-05-24 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
Download PDF:
Previous Patent: SOLID PEST CONTROL COMPOSITION COMPRISING CYCLANILIPROLE OR SALT THEREOF
Next Patent: SURGICAL TOOL
Next Patent: SURGICAL TOOL